When my launch xbox died, i had a newer build date console back in 4 days.
The RRoD is caused by the same problem, and that is solder joints cracking due to heat and stress of the X Clamps flexing the board… i would think they would have it down to a science… shit i can fix it in 10 minutes at home.
Theres not really a new cooling system… well there is a new heatsink unit for the GPU with a 2nd external heatsink attached via heatpipe, but it is not too effective…
There is a new heatsink on the new 65nm CPU equipped boxes, one without heatpipes, a less effective heatsink, but sufficient for the 65nm CPU’s which produce significantly less heat.