STOP DOING THIS!!!
Does anyone here know why the 360 is failing? It’s because of HEAT. So you’re going to make it heat up MORE?!
Let me explain what is wrong with the 360. The circuit board is made out of the thinnest possible material they could find to cut costs. The processor isn’t mounted in a socket(to cut more costs), it’s just soldered half-assed into it. When the processor heats up, the board warps from the weight of the processor chip. While it’s on, it’s not really a problem but it’s when it cools off that things go bad, the solder connections break. The more you heat it up while it’s running, the more the board warps and the larger the cracks become when it cools until eventually they won’t ever touch again.
MS didn’t do the proper testing for this thing, they just shoved it out the door knowing that there are 2 billion stupid MS fanboys out there that will buy it and keep coming back even though there is a 33% failure rate and THEY HAVEN’T FIXED THE PROBLEM. I just saw a video of one in their own consumer display with a RROD and this was supposed to be the new ‘fixed’ model. Don’t think so.
If you’re one of the lucky ones that hasn’t seen the RROD, elevate it off the ground, make sure it’s out in the open and put a fan on it.